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Home/Categories/Boards/ESP32-C5 Pro Super Mini Development Board – ESP32C5HF4 Dual-Band WiFi 6, Bluetooth 5.3, Zigbee 3.0 & Thread 1.4 – Unsoldered Header
ESP32-C5 Pro Super Mini Development Board – ESP32C5HF4 Dual-Band WiFi 6, Bluetooth 5.3, Zigbee 3.0 & Thread 1.4 – Unsoldered Header

ESP32-C5 Pro Super Mini Development Board – ESP32C5HF4 Dual-Band WiFi 6, Bluetooth 5.3, Zigbee 3.0 & Thread 1.4 – Unsoldered Header

SKU: TT-ED54E65A2B70

₹554.60

Includes 18% GST

Product Description The ESP32-C5 Pro Super Mini Development Board is a compact and versatile wireless development platform based on the ESP32-C5 series SoC. It combines dual-band 2.4 GHz and 5 GHz Wi-Fi 6 connectivity with Bluetooth Low Energy and IEEE 802.15.4-based Zigbee 3.0 and Thread 1.4 support, making it well s…

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Product description

Product Description

The ESP32-C5 Pro Super Mini Development Board is a compact and versatile wireless development platform based on the ESP32-C5 series SoC. It combines dual-band 2.4 GHz and 5 GHz Wi-Fi 6 connectivity with Bluetooth Low Energy and IEEE 802.15.4-based Zigbee 3.0 and Thread 1.4 support, making it well suited for modern IoT, smart home, Matter, automation, wireless sensor, and embedded applications.

The board uses the ESP32-C5HF4 variant and features a 32-bit single-core RISC-V processor capable of operating at up to 240 MHz. The ESP32-C5 platform provides up to 29 programmable GPIOs along with a wide range of peripheral interfaces, allowing developers to connect sensors, displays, actuators, communication modules, and other electronic components.

Its Super Mini form factor makes it suitable for space-constrained embedded projects, while the unsoldered header design gives users flexibility for custom assembly, direct soldering, breadboard integration, and specialized PCB or mechanical installations.

With support for multiple wireless protocols, the board can be used in applications requiring Wi-Fi connectivity together with Bluetooth LE or 802.15.4-based wireless networks. The ESP32-C5 is designed with wireless coexistence support for Wi-Fi, Bluetooth LE, and 802.15.4, making it suitable for multifunctional connected devices.

Features

  • Powered by ESP32-C5HF4 wireless SoC
  • 32-bit single-core RISC-V processor up to 240 MHz
  • Dual-band Wi-Fi 6 support on 2.4 GHz and 5 GHz
  • Bluetooth Low Energy connectivity
  • Zigbee 3.0 support
  • Thread 1.4 support
  • IEEE 802.15.4 wireless connectivity
  • Supports modern Matter and smart home applications
  • Compact Super Mini development board
  • Unsoldered header version for flexible installation
  • Supports wireless protocol coexistence
  • Up to 29 programmable GPIOs at the chip level
  • Rich peripheral interfaces including UART, SPI, I2C, I2S, PWM, ADC, USB Serial/JTAG, and more
  • USB interface for programming and debugging
  • 3.3V operating supply
  • Suitable for low-power IoT applications
  • Compatible with common ESP32 development environments
  • Ideal for embedded wireless and automation projects

Specifications

Parameter Specification
Product Type ESP32-C5 Pro Super Mini Development Board
Main SoC ESP32-C5HF4
CPU 32-bit Single-Core RISC-V
CPU Frequency Up to 240 MHz
Wi-Fi Dual-Band Wi-Fi 6 (802.11ax)
Wi-Fi Frequency 2.4 GHz & 5 GHz
Bluetooth Bluetooth LE
Zigbee Zigbee 3.0
Thread Thread 1.4
Wireless Standard IEEE 802.15.4
Flash Memory 4 MB
GPIO Up to 29 GPIOs (chip capability)
Operating Voltage 3.3V
USB USB Programming / Debugging
Interfaces GPIO, UART, SPI, I2C, I2S, PWM, ADC and more
Development Support Arduino IDE, ESP-IDF, PlatformIO, MicroPython*
Header Type Unsoldered Pin Header
Board Type Super Mini Development Board
Applications IoT, Matter, Smart Home, Automation, Wireless Sensors, Embedded Systems

*Software and development environment support can depend on the board package, framework version, and available software libraries.

Design and Construction

The ESP32-C5 Pro Super Mini Development Board is designed around the compact ESP32-C5 wireless platform, providing advanced wireless connectivity in a small form factor.

The unsoldered header configuration allows users to customize the board according to their project requirements. It can be used for direct soldering, custom PCB integration, wired prototyping, or other embedded installations where a pre-soldered pin header may not be preferred.

The compact board design makes it useful for installations where PCB space is limited, including small IoT devices, wireless sensors, automation controllers, smart home products, and experimental embedded systems.

Working Principle

The ESP32-C5 acts as the main processing and wireless communication controller for the project. User applications can be programmed into the board through the USB programming/debugging interface.

The processor can control connected sensors, LEDs, displays, motors, relays, and other peripherals through its available GPIO and peripheral interfaces.

For wireless communication, the ESP32-C5 provides dual-band Wi-Fi 6 together with Bluetooth LE and IEEE 802.15.4 connectivity for Zigbee and Thread applications. This makes the platform suitable for connected devices that need different wireless communication methods within a single controller.

Applications

  • IoT development
  • Smart home devices
  • Matter-compatible projects
  • Wireless sensor nodes
  • Home automation
  • Industrial automation
  • Wireless monitoring systems
  • ESP32-based embedded projects
  • Wi-Fi 6 IoT devices
  • Bluetooth LE projects
  • Zigbee devices
  • Thread-based applications
  • Smart lighting systems
  • Environmental monitoring
  • Remote control systems
  • Robotics projects
  • Edge devices
  • Connected appliances
  • Low-power wireless applications
  • Custom embedded systems
  • Educational electronics projects
  • Prototype development

Package Includes

  • 1 × ESP32-C5 Pro Super Mini Development Board

Product Disclaimer

Product images are shown for illustrative and representational purposes only. The actual board may vary slightly in PCB colour, component placement, connector design, antenna configuration, dimensions, or appearance depending on the manufacturing batch.

Headers are not pre-soldered on this version. Additional cables, sensors, antennas, modules, accessories, and other components shown in product images are not included unless specifically mentioned in the package contents.

The availability of particular software features, protocol stacks, and development-framework support may vary depending on firmware, SDK, library, and board configuration.

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